Circuit board adhesives for soldering environments
CA 2222053 A1 · Owner: Occidental Chemical Corporation · Inventors: Rosenfeld, Jerold C.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Disclosed is a method of bonding integrated circuit chips to lead frames where the leads are later soldered. A solution of an adhesive polyimide is used. The polyimide is the reaction product of an aromatic dianhydride and a mixture of an aromatic diamine and an aliphatic diamine.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 25, 1997. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 25, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 25, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.