Ultrasonic vibration bonding chip mounter
CA 2205763 C · Owner: Katsumi, Mitsugu · Inventors: Sato, Shigeru; Katsumi, Mitsugu; Nakai, Seiya
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An ultrasonic vibration bonding chip mounter comprises a chip carrying unit arranged above a chip supply unit a, prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 21, 1997 and granted April 24, 2001. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended May 21, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 21, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.