Hollow package manufacturing method and apparatus
CA 2201083 C · Owner: Ogihara, Takeo · Inventors: Sato, Taku; Uchida, Kenji; Kimura, Tomoaki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step an, open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 26, 1997 and granted November 27, 2001. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 26, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 26, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.