Thermal printhead assembly
CA 2200644 C · Owner: Nishi, Koji · Inventors: Nishi, Koji
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A thermal printhead assembly includes a metallic heat sink plate, a head circuit board mounted on an obverse surface of the heat sink plate, and a control circuit board electrically connected to the head circuit board for feeding control signals and power supply to the head circuit board. The head circuit board is formed with a heating resistor. A reverse surface of the heat sink plate is mounted on the control circuit board so that the heat sink plate is sandwiched between the head circuit board and the control circuit board.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 21, 1997 and granted July 18, 2000. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 21, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 21, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.