Solder connection testing between electronic components and substrates carrying the components
CA 2199900 A1 · Owner: Northern Telecom Limited · Inventors: Troli, Michel
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A printed circuit board or other substrate with terminal positions for mounting an electronic component on the substrate. At each terminal position a pair of, terminals is provided upon the substrate. With the electrical component soldered in position a terminal of, the component bridges across and electrically interconnects the terminals of the pair at each terminal position. With this arrangement, the solder connection to the electronic component may be tested by connecting a first test location to or source of electrical power, the first test location electrically connected to one of a pair of terminals and determining from a second test location whether current is passing between the …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 13, 1997. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended March 13, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 13, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.