An electronic-circuit assembly and its manufacturing method
CA 2199796 C · Owner: Nec Corporation · Inventors: Inoue, Tatsuo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An electronic-circuit assembly of the present invention comprises a plurality of film carriers which are stacked. Respective film carriers have a plurality of through-holes. One of through-holes is provided on corresponding position to another through-hole in the stacked direction of the substrate. Two of adjacent film carriers are connected by the corresponding through-holes. A connection member is provided in two of adjacent through-holes in the stacked direction of the substrates. A connection state between film carriers can be easily checked. Since it is visually checked that solder appears invite the topmost through-hole. Furthermore wiring, lengths for connection between substrates …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 12, 1997 and granted January 22, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 12, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 12, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.