Package
CA 2196268 C · Owner: Ichikawa, Seiji · Inventors: Ichikawa, Seiji; Kubota, Tsutomu; Ogihara, Takeo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package of the present invention comprises a base molded integrally with a lead frame by resin a, chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it and the substrate portion and an, anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 29, 1997 and granted October 2, 2001. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended January 29, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 29, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.