Integrated circuit packaging structure
CA 2195038 C · Owner: Nec Corporation · Inventors: Miyoshi, Tadayoshi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package structure for an integrated circuit according to the present invention comprises tape carriers 1a - 1e and a pin 22 vertically mounted on a wiring board 2. LSIs 12 are mounted on the tape carriers 1a - 1e respectively. The tape carriers 1a - 1e comprise base films 13 respectively. External connection terminals 11 are provided on the base film 13 in a lattice. The external connection terminal 11 comprises a through hole 18 and a conductive pattern 17 provided on the inner surface of the through hole 18. The pins 22 vertically mounted on the wiring board 2 are inserted into the external connection terminals 11 of the tape carriers 1a - 1e. The external connection terminals 11a - 11e …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 14, 1997 and granted July 15, 2003. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended January 14, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 14, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.