Method for production of microcapsule type conductive filler
CA 2189801 C · Owner: Fujitsu Limited · Inventors: Watanabe, Isao; Usui, Makoto; Hozumi, Yuko
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for the production of the microcapsule (MC) type conductive filler of this invention comprises (a) a step involving immersing minute conductive particles in an affinity agent thereby treating the surface of the minute conductive particles, (b) a step involving immersing and dispersing the surface-treated minute conductive particles in an epoxy monomer thereby forming a suspension, and (c) a step involving polymerizing the monomer in the suspension thereby forming a thermosetting insulating polymer on the surface of the minute conductive particles. There is also disclosed an MC type conductive adhesive agent having dispersed in an adhesive agent an MC type conductive filler coated …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 23, 1992 and granted December 12, 2000. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 23, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 23, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.