Integrated silicon vacuum micropackage for infrared devices
CA 2179052 C · Owner: Higashi, Robert E. · Inventors: Ridley, Jeffrey A.; Higashi, Robert E.; Wood, R. Andrew
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An efficient method brings together two wafers of dies that contain infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably by solder although ultrasound bonding can be used.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 12, 1994 and granted February 13, 2001. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended December 12, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 12, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.