Three-dimensional processor using transferred thin film circuits
CA 2173123 A1 · Owner: Vu, Duy-Phach · Inventors: Zavracky, Matthew; Vu, Duy-Phach; Zavracky, Paul M.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 29, 1994. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended September 29, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 29, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.