Method for forming solder balls on a semiconductor substrate
CA 2135508 C · Owner: Lyn, Robert J. · Inventors: Lyn, Robert J.; Aulicino, Anthony M.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for forming solder ball contacts on a ball grid array is described. The solder balls are formed by sqeegeeing a solder paste through apertures in a fixture into contact with pads on a substrate heating the fixture, paste and substrate to reflow the solder paste into solder balls that attach to the pads and are detached from the fixture. After cooling the fixture is readily separated from the substrate and leaves the solder balls in conductive contact with contact pads on the substrate.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 9, 1994 and granted November 3, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 9, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 9, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.