Surface mount assembly of devices using adcon interconnections
CA 2134575 C · Owner: American Telephone And Telegraph Company · Inventors: Dahringer, Donald William; Lyons, Alan Michael
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An apparatus for and a process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated onto a printed wiring board, (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons) and leads to the reduction of, variations in initial interconnection resistance and thereby to the enhancement of the, reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 28, 1994 and granted August 31, 1999. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 28, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 28, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.