Precision machining of a warped wafer
CA 2132116 A1 · Owner: Herve, Patrick Jean Pierre · Inventors: Herve, Patrick Jean Pierre
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of precision machining at least one cut into an article having a non-uniform surface wherein the cut is, of substantially constant depth relative to the non-uniform surface. One aspect of the invention is a machined optical wafer having two adjacent notches, to serve as a platform for a fiber optic pigtail, machined into the edge of the wafer. Another aspect of the invention is a method of automatically machining a plurality of notches into an optical wafer. For optical wafers having embedded light paths light, detected from these light paths may be used to compensate for the variation in embedded depth of the light paths.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 15, 1994. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended September 15, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 15, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.