Surface mount solder assembly of leadless integrated circuit packages to substrates
CA 2127948 C · Owner: Degani, Yinon · Inventors: Woods, William Lonzo, Jr.; Degani, Yinon; Dudderar, Thomas Dixon
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Described are a process for soldering at least one component having solder bumps to a substrate and a process for forming solder bumps on metal pads of an element such as an IC package or substrate or both. The bumps are formed by stencil printing solder paste deposits on the metal pads heating the solder paste deposits to reflow temperature of the solder in the solder paste deposits and allowing the molten solder in each deposit to coalesce and during subsequent cooling solidify forming the bumps on the metal pads. The bumps are formed by conducting the stencil printing through apertures in an ultra-thick stencil the apertures having trapezoidal crossection in the plane normal to the broad …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 12, 1994 and granted May 18, 1999. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended July 12, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 12, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.