Packaging structure for microwave circuit

Abstract From the Canadian patent

A packaging structure for a microwave circuit having excellent heat radiation and obviating an intricate and large-sized shielding case is provided the packaging, structure comprising a circuit module accommodating internally a semiconductor element and a mother substrate 10; the circuit module 1 having two grounding conductor layers, a center conductor layer inserted therebetween center conductor electrodes connected to the center conductor, grounding conductor electrodes disposed in the vicinity thereof, on one of its surfaces and a, thermal spreading plate connected to the other surface; the mother substrate 10 having two grounding conductor layers, a center conductor layer inserted …