Bare die testing
CA 2127234 A1 · Owner: Plessey Semiconductors Limited · Inventors: Pedder, David John
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Bare Die Testing, This invention relates to bare integrated circuit die testing apparatus of the kind comprising a testing station wherein a plurality of microbumps of conductive material are located on interconnection trace terminations of a multilayer interconnection structure which, terminations are distributed in a pattern corresponding to the pattern of contact pads on the die to be tested. To facilitate testing of the die before separation from a wafer using the microbumps, the other connections provided to an and from the interconnection structure have a low profile. (Fig.2)
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 30, 1994. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 30, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 30, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.