Cooling apparatus for integrated circuit chips
CA 2126291 C · Owner: Nec Corporation · Inventors: Yoshikawa, Minoru
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A cooling apparatus for integrated circuit chips in which the pressure of coolant does not affect is disclosed. The block is provided with a plurality of holes. Cooling members are inserted in these holes. An elastic member is filled between the block and the cooling member. The cooling member is supported to the block by the elastic member. Each cooling members is connected each other by pipes. A bellows is provided between the cooling member and the pipe. When the block is loaded on the substrate on which the integrated circuit chips are mounted, the elastic member deforms and the cooling member displaces in accordance with the height and inclination of the integrated circuit chip. The …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 20, 1994 and granted October 13, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended June 20, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 20, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.