Solder paste formulations for use in the electronics industry
CA 2125688 C · Owner: King, Charles Edmund · Inventors: Mackie, Andrew Christopher; King, Charles Edmund; Paterson, Geoffrey Andrew
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A stable solder paste or cream for use in the electronics industry which comprises i)a nonaqueous vehicle and ii) a solder power filler material, characterized in that the vehicle is an emulsion of two or more immiscible organic liquids of at least 60 vol % disperse phase, one of which liquids is a polar organic solvent or a mixture thereof, and the other of which liquid is an aliphatic hydrocarbon, or a mixture thereof, and in that the solder paste or cream mixture when reflowed at a temperature in the range of up to 270 °C, yields less than 2.5 wt % organic residues based on the weight of the solder paste or cream.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 30, 1992 and granted July 14, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 30, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 30, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.