Patent Yard Sign in
Canadian application, no grantCanada

Method for the manufacture of waferboard

CA 2125316 A1 · Owner: The Mearl Corporation · Inventors: Umansky, Harold; Coakley, Robert J.

CIPO record

Overview

Drawings and full text

Its claims, description and drawings are in the Canadian Patents Database.

Open the CIPO record

Abstract From the Canadian patent

A method for applying release agent to wood material and binder used in the manufacture of chipboard. An aqueous solution of the release agent is foamed to form a coherent foam blanket that is applied to the wood material and binder. The foam leaves a coating of release agent on the wood material and binder that enhances release of a platen from the same. Foaming the release agent avoids deleterious aerosolization and increases the efficiency of applying the release agent.

Read the whole patent

Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed June 7, 1994. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 7, 2014.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 7, 2016.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledJune 7, 1994
GrantedNo grant recorded
Term endedJune 7, 2014
Patent numberCA 2125316 A1
Classification (IPC)B29C33/58 +2 more

Timeline

Timeline From CIPO dates

1995199719992001200320052007200920112013Application filedJune 7, 1994Term endedJune 7, 2014

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.