Solder alloy having decreased fatigue rupture occurring on soldered joints exposed to heat cycle stress
CA 2122376 C · Owner: Nishimura, Tetsuro · Inventors: Nishimura, Tetsuro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The fatigue rupture taking place at a soldered joint due to a heat cycle can be alleviated. Effective use of Cu added solder. This solder is basically consisting of 57 to 65% of Sn, 0.1 to 0.5% of Sb, 0.002 to 0.5% of Te and balancing Pb all in weight. This invention has introduced a solder alloy comprising the base composition with supplement of 0.001 to 0.5% of Ga and/or 0.1 to 0.3 of Cu, all in weight.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 28, 1994 and granted June 1, 1999. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended April 28, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 28, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.