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Canadian application, no grantCanada

Epoxy resin composition

CA 2121876 A1 · Owner: Yasuda, Kiyomi · Inventors: Nakamura, Hideo; Yasuda, Kiyomi; Suzuki, Terufumi

CIPO record

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Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

An epoxy resin composition which exhibits a low dielectric constant and a low dielectric dissipation factor as well as an excellent working susceptibility after its curing is provided. The epoxy resin composition contains at least one member selected from a novolak resin (A) prepared by condensing formalin and an alkylphenol compound; and an epoxy resin (B) prepared by glycidylating said novolak resin (A) with an epihalohydrin.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed April 21, 1994. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended April 21, 2014.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 21, 2016.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledApril 21, 1994
GrantedNo grant recorded
Term endedApril 21, 2014
Patent numberCA 2121876 A1
Classification (IPC)C08G8/08 +2 more

Timeline

Timeline From CIPO dates

1995199719992001200320052007200920112013Application filedApril 21, 1994Term endedApril 21, 2014

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.