Power supply structure for multichip package
CA 2121772 C · Owner: Umesato, Shoji · Inventors: Umesato, Shoji
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A power supply structure for a multichip package is provided to improve the transmission performance of signals. Cases are fitted onto one face of a ceramic substrate. On the other face are aligned substrates. On each of the substrates are erected I/O pins. The I/O pins are connected to signal pins of LSIs via the ceramic substrate's internal layer. On side faces of the substrates are provided power supply pads. To the power supply pads are connected the power supply pins of the LSIs via the ceramic substrate's internal layer. When power is to be supplied electroconductive bars, are inserted between the substrates. The electroconductive bars supply power to the LSIs via the power supply …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 20, 1994 and granted July 14, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended April 20, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 20, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.