Phenol formaldehyde steam pressing of waferboard
CA 2117529 C · Owner: Lim, Jau Tong Christopher · Inventors: Chiu, Shui-Tung; Lim, Jau Tong Christopher
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention relates to a method of producing a waferboard by applying first a liquid phenol formaldehyde resin (12) to the surface of the wafers (10) then a powdered phenol formaldehyde resin (14) followed by forming a layup (16) and pressing at elevated temperature and pressure using steam pressing techniques (18) to consolidate the layup into a board and set the phenol formaldehyde adhesive.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 25, 1993 and granted May 27, 2003. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 25, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 25, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.