Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
CA 2114954 A1 · Owner: Schmidt, Walter · Inventors: Schmidt, Walter; Martinelli, Marco
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
P0756.PCT, - 38 -, ABSTRACT, In the metal-clad laminate according to the invention it is assumed that the requirements concerning the mechanical strength are functionally separated from the circuit connection requirement so as to be able to bring the circuit, connection particularly for signals, "closer" to the electrotechnical characteristics of the chips. For this purpose and without taking account of the mechanical strength of the substrate, the layout miniaturization is optimized. In placeof a circuit board (MCM) a laminate which can be built up to a circuit board is produced. The inventive laminate comprises an extremely thin foil with a plurality of extremely small holes …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 9, 1993. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 9, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 9, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.