Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points

Abstract From the Canadian patent

The method for producing subsequently contactable contact points or pads between two conducting path planes of a circuit carrier separated from one another by an electrically insulating layer offers the possibility of e.g. producing a basic conductor diagram which can be quickly subsequently easily adapted to the corresponding needs. By making windows in the conducting path planes in such a way that during the following through-etching of the electrically insulating layer by undercutting land-like parts connected to the opening periphery are exposed between or in the openings and said exposed land-like parts can be contacted with electrically conductive parts of the other conducting path …