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Canadian application, no grantCanada

Hot-melt adhesive composition

CA 2111493 A1 · Owner: Kuroiwa, Toshiaki · Inventors: Tokita, Suguru; Inagaki, Hajime; Muro, Tuneaki

CIPO record

Overview

Drawings and full text

Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

A hot-melt adhesive composition containing (A), per 10 to 80 parts by weight of a base polymer (B) 10, to 80 parts by weight of a stickiness-imparting agent which is a copolymer of a particular styrene-type monomer and a particular indene-type monomer the molar, ratio of the indene-type monomer to the styrene-type monomer being from 99/1 to 30/70, and the weight average molecular weight of said copolymer being from 300 to 5000. The hot-melt adhesive composition exhibits excellent heat-resistant adhesiveness and heat-resistant creeping property, and has a lowmolecular weight and exhibits good hue.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed December 13, 1993. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 13, 2013.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 13, 2015.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledDecember 13, 1993
GrantedNo grant recorded
Term endedDecember 13, 2013
Patent numberCA 2111493 A1
Classification (IPC)C09J125/16 +2 more

Timeline

Timeline From CIPO dates

1994199619982000200220042006200820102012Application filedDec 13, 1993Term endedDec 13, 2013

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.