Electronic module of extra-thin construction
CA 2109761 C · Owner: Esec Sempac S.A. · Inventors: Nicklaus, Karl
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
In the electronic module (M) of extra-thin construction disclosed, it is the principal object to substantially reduce the tendency to fracture of the module's semiconductor chip (1) embedded in the plastic casing (10) of the module (M) notwith-standing the extremely small thickness of the casing. The chip is fitted on the chip pad (22) of a system support (20) formed by a thin metal strip, commonly known as a lead frame. The chip (1) may partly overlap the external contacts (21) of the module that lie on one of the flat sides of the module's plastic casing (10). Slits (23) in the system support which form the boundaries, of the chip pad (22) and are inevitable lines of weakness in the thin …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 23, 1993 and granted January 6, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 23, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 23, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.