Composite microwave circuit module assembly and its connection structure
CA 2109441 C · Owner: Minowa, Yoshio · Inventors: Omagari, Shin-Ichi; Watanabe, Hideo; Kusamitsu, Hideki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A composite microwave circuit module assembly has a dielec- tric substrate which is formed by a lower layer an in- termediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 28, 1993 and granted May 13, 1997. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 28, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 28, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.