Method and apparatus for electrolytically plating copper
CA 2105724 A1 · Owner: Murphy, David A. · Inventors: Murphy, David A.; Glafenhein, Karl L.; Hachisuka, Shunji
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract of the Disclosure, A method for electrolytically plating copper onto a base metal, such as steel (18), utilizing an insoluble anode (16) includes the steps of: providing a pyrophosphate plating solution (14); adding a copper source, copper hydroxide, to the plating solution (14); and passing an electric current through the plating solution between the insoluble anode (16) and the base metal (18) to be plated. The apparatus (10) includes a plating tray (12), a pyrophosphate plating solution (14) including a soluble source of copper an insoluble, anode (16) and a power source (20). A copper plated product (P) is also disclosed and claimed.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 8, 1993. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended September 8, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 8, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.