Electroless copper deposition
CA 2101881 A1 · Owner: Amp-Akzo Corporation · Inventors: Mayernik, Richard A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An improved method of manufacturing fullyadditive or partly-additive printed wiring boards by electrolessly depositing copper on an insulating substratum and the walls of plated-through holes wherein the copper deposit has increased resistance to failure due to thermal stress or thermal cycling. The electroless copper plating bath contains a copper compound, ethylenediaminetetraacetic acid as a complexing agent for copper, a reducing agent capable of reducing the copper compound to metallic copper and addition agents selected from inorganic germanium and silicate compounds and combined with a polyethylene glycol. The pH of the electroless copper bath is monitored and maintained between 11.2 …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed August 4, 1993. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended August 4, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by August 4, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.