Multichip module and integrated circuit substrates having planarized patterned surfaces
CA 2101426 A1 · Owner: Boeing Company (The) · Inventors: Cech, Jay Martin; Burnett, Andrew Frank
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of filling features of a substrate to produce a planar patterned surface on said substrate is disclosed. The method includes the steps of: providing a substrate (2) containing a pattern of features (4) defined by a dielectric material (6) depositing , thereon a layer of a conductor (12) whereby first portions of the conductive layer (8) cover the dielectric material second, portions of the conductor layer (10) fill the features and third, sidewall portions (12) of the conductive layer connect the first and second portions; coating the substrate with a resist (16) and patterning the resist with a resist pattern similar to said pattern of features; etching away all portions of the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 10, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended February 10, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 10, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.