Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
CA 2098330 C · Owner: Fortune, G. Clark · Inventors: Fortune, G. Clark
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat conduction therebetween is facilitated by a plurality of heat conduction channels passing through one layer to another where the heat generated by the semiconductor device is conducted into the conducting layers via the heat conduction channels and into a heat dissipation device such as an aluminum heat sink.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 14, 1993 and granted July 13, 1999. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended June 14, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 14, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.