Semiconductor device
CA 2092767 A1 · Owner: Takikawa, Takatoshi · Inventors: Yamanaka, Shosaku; Ban, Shunsuke; Takikawa, Takatoshi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A semiconductor device which can reduce noise which, can be used for a variety of different purposes in a flexible manner, and which is suitable for automatic assembly. It has a metal board carrying a semiconductor device chip on the central part thereof. An insulating layer, a ceramic laminated wiring board an organic film, and a lead frame are laminated one on another on the metal board so as to surround the semiconductor device chip. The lead frame is connected to the semiconductor device chip through the ceramic laminated wiring board. The assembly thus formed is sealed with a synthetic resin.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 26, 1993. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended March 26, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 26, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.