Integrated circuit packaging
CA 2092371 C · Owner: Harpell, Kevin E. · Inventors: Harpell, Kevin E.; Livshits, Boris L.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package is provided for an integrated circuit comprising a dielectric body enclosing the integrated circuit chip having a plurality of conductive terminal members extend through the dielectric body. The dielectric body includes a magnetic shielding layer for electromagnetic radiation from the integrated circuit. The magnetic shielding layer comprises a material having a high magnetic permeability and a high resistivity so that the, dielectric body absorbs electromagnetic radiation at frequencies generated by the integrated circuit and thereby attenuates electromagnetic emissions from the integrated circuit. Suitable materials having a high dielectric constant and high magnetic …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 24, 1993 and granted June 29, 1999. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 24, 2013.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 24, 2015.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.