Bonding tool and its fabrication

Abstract From the Canadian patent

The disclosure is directed to a bonding tool for use primarily in thermo-compression bonding of electronic circuit components and to a method of making the bonding tool. In one form of the disclosure, a holder is provided and has a substrate mounted at an end thereof. The holder is adapted to receive a heating element. A polycrystalline diamond film is disposed on the substrate, the film preferably being deposited by chemical vapor deposition. In a disclosed embodiment the substrate is a material selected from the group consisting of polycrystalline diamond, cemented tungsten carbide, silicon carbide cubic boron, nitride, and tungsten. In a further form of the disclosure a, ceramic …