Low inductance package for multiple paralleled devices operating at high frequency
CA 2085644 A1 · Owner: El-Hamamsy, Sayed-Amr A. · Inventors: El-Hamamsy, Sayed-Amir A.; Borowiec, Joseph C.; El-Hamamsy, Sayed-Amr A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract, A low-inductance package for multiple paralleled devices includes an electrically insulating substrate having three power terminals direct-bonded to the upper surface thereof and a conductive pad direct-bonded to the lower surface thereof for connection to a heat sink. Two groups of multiple parallel-coupled devices are each soldered to one of the three power terminals and are further connected in a half-bridge configuration such that one of the three power terminals is common to both groups of devices. The package further includes a pair of first Kelvin terminals, i.e. a first Kelvin control terminal and a first Kelvin source terminals and a pair of second Kelvin terminals, i.e. …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 17, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 17, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 17, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.