Bonding method using solder composed of multiple alternating gold and tin layers
CA 2080931 C · Owner: Lee, Chien-Hsun · Inventors: Katz, Avishay; Wong, Yiu-Man; Lee, Chien-Hsun
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Abstract, A device such as a laser is bonded to a submount such as diamond by a process in which the submount is successively coated with an adhesion layer such as titanium, a barrier layer such as nickel and a gold-tin solder-metallization composite layer formed by sequential deposition on the barrier layer a number (preferably greater than seven) of multiple alternating layers of gold and tin the last layer being, gold having a thickness that is equal to approximately one-half or less than thethickness of the (next-to-last) tin layer that it contacts immediately beneath it. The bonding is performed under applied heat that is sufficient to melt the soldermetallization composite layer. …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 20, 1992 and granted August 23, 1994. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 20, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 20, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.