Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques
CA 2077720 C · Owner: Mccoy, Dirk D. · Inventors: Johansen, Scott W.; Mccoy, Dirk D.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The process of the present invention allows interconnecting one conductive layer to another in a Multichip Module. The process uses bumps formed by wire bonding or any other means of forming bumps of .002"-.004" height with comparable diameter. These bumps create an opening through dielectric insulating layers, thereby allowing one conductive layer to be electrically connected to the next conductive layer.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 8, 1992 and granted January 22, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended September 8, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 8, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.