Flow-inducing panels for electroless copper plating of complex assemblies

Abstract From the Canadian patent

Flow-inducing panels for use in electroless copper plating of complex plastic microwave assemblies. A panel comprises a rigid baffle having openings adapted to secure microwave assemblies therein. The panel has a size relative to the electroless copper plating tank that causes sufficient plating solution flow through the channels in the microwave assemblies by minimizing solution flow bypassing of the channels. This achieves complete copper plating of the inner surfaces in the channels. A relatively large panel builds up back pressure as it approaches plating tank walls which, creates a pressure differential as it moves through the plating tank thus forcing solution, through the channels. …