Semiconductor device
CA 2072734 A1 · Owner: Hashinaga, Tatsuya · Inventors: Hashinaga, Tatsuya
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A semiconductor device including a substrate having terminals for electrical connection to the outside a, semiconductor chip mounted on the substrate by employing a flip chip process, and a synthetic resin for sealing the substrate and the semiconductor chip in the semiconductor device wherein, the semiconductor device includes a metallic pattern rectangularly formed on the functional surface of the semiconductor chip to completely surround the functional region on the semiconductor chip and a metallic pattern rectangularly formed on the substrate corresponding to the metallic pattern on the semiconductor chip, and that a gap between the semiconductor chip and the substrate is airtightly …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 29, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 29, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 29, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.