Copper-based paste containing copper aluminate, for microstructural and shrinkage control of copper-filled vias
CA 2072727 A1 · Owner: Aoude, Farid Y. · Inventors: Mastreani, Anthony; Reddy, Srinivasa S. N.; Herron, Lester W.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on ceramic, substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 29, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 29, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 29, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.