Semiconductor chip module and method of manufacturing the same
CA 2072377 A1 · Owner: Sumitomo Electric Industries, Ltd. · Inventors: Nishiguchi, Masanori
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The semiconductor chip module comprises a substrate on which a wiring portion is formed a, semiconductor chip mounted so as to face a circuit side down to the wiring portion, a heat sink with one end in contact with a side opposite to the circuit side of the semiconductor chip, and a cap enclosing the semiconductor chip and having an opening exposing externally the other end of the heat sink. A metal film is formed at least on the inner wall of the opening and on the surface of the heat sink which is inserted into the cap. An adhesive material is filled between the tip portion of the heat sink and the semiconductor chip, while an adhesive material is filled between the metal films.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 25, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 25, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 25, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.