Integrated socket-type package for flip-chip semiconductor devices and circuits
CA 2071662 A1 · Owner: Hughes Aircraft Company · Inventors: Shoda, Craig K.; Gulick, Jon J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A multi-layer circuit board (11) has a configuration of traces (27) within the volume of the multi layer circuit board (11) to facilitate mountable conductive contact with semiconductor chips (13) through holes (23) formed in the multi-layer circuit boards (11) which are filled with solder or conductive epoxy. Semiconductor chips (13) have an array of metallic posts (19) alignable with holes (23) and are mounted upon the upper surface of the multi-layer circuit board (11) in plug fashion. An aperture (25) may be formed in multi-layer circuit board (11) directly below each semiconductor chip (13) for protection of the circuitry on semiconductor chip (13) from contact with multi-layer circuit …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 19, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 19, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 19, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.