Direct thermocompression bonding for thin electronic power chips
CA 2071496 C · Owner: Paik, Kyung Wook · Inventors: Mcmullen, James Gilbert; Neugebauer, Constantine Alois; Paik, Kyung Wook
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Annealed copper foil (12) is coated with chromium film (16) followed by , coating with an appropriate thickness of gold film (14) and is thermocompression bonded to an aluminum metallized substrate (18) on a silicon chip (30) to provide solderable high current contacts to the chip. The foil is formed into appropriate electrical network-contact patterns (40) and is bonded to the silicon chip only where aluminum metallization exists on the chip. Leaf (wing) portions (46) of the foil extend beyond the boundaries of the silicon chip for subsequent retroflexing over the foil to provide electrical contact at predesignated locations (49). External contacts to the foil are made by penetrating …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 24, 1991 and granted May 14, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 24, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 24, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.