Process for manufacturing printed circuits employing selective provision of solderable coating
CA 2067710 A1 · Owner: Macdermid, Incorporated · Inventors: Larson, Gary B.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The areas of a printed circuit where electrical components are to be solder connected, such as throughholes, surrounding pads and surface mount areas are, selectively provided with a metal coating (e.g. tinlead) which preserves and promotes solderability thereat by a process in which a photoimageable electrophoretically deposited organic resin is used to provide on an, already patterned surface, an additional resist pattern which selectively exposes areas on which the solderable metal coating is to be provided and in which the resist serves also as an etch resist for metal areas over which it is arranged.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 30, 1992. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended April 30, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 30, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.