Solder-coated printed circuit board and method of manufacturing the same
CA 2063682 C · Owner: Shiroishi, Hirokazu · Inventors: Kosuga, Izumi; Kohno, Masanao; Fukunaga, Takao
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H < W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween and that, the pad width W and a pad-to-pad distance D satisfy a relation W > D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 20, 1992 and granted April 15, 1997. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 20, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 20, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.