Electronic circuit package
CA 2061949 C · Owner: Akiyama, Masatsugu · Inventors: Okishima, Tetsuya; Ihara, Hirokazu; Kawabata, Kiyoshi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An electronic circuit package has a wiring substrate at, least two semiconductor chips and a bus line. All the semiconductor chips are connected by means of the bus line and are bare chip packaged on a substrate. The chips and the wiring substrate are connected by wiring bonding between pads formed on the chips and the substrate. The substrate may be a multilayer. Preferably, there is an insulating layer partially formed on a surface of the multilayer substrate and, a die bonding ground is formed on a surface of the insulating layer in order to use a portion of the substrate under the ground as a wiring or hole region. At least one of the chips is formed on the die bonding ground. The bus …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 27, 1992 and granted January 27, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 27, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 27, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.