Structure of semiconductor ic chip
CA 2061522 C · Owner: Dohya, Akihiro · Inventors: Dohya, Akihiro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A structure of semiconductor IC (Integrated Circuit) chip carrier feasible for a multi-terminal arrangement and high-speed signal propagation. Input/output terminals in the form of pins or bumps are directly provided on the circuit surface of an IC chip to serve as the leads of a chip carrier. A heat spreader is soldered or otherwise affixed to the rear of the IC chip and plays the role of the body of the chip carrier. The IC chip itself may be buried in the heat spreader by a seal resin.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 19, 1992 and granted August 11, 1998. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 19, 2012.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 19, 2014.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.