Method of forming an electrically conductive contact on a substrate
CA 2055148 C · Owner: Viasystems Canada G.P. · Inventors: Auger, Benoit; Casavant, Charles; Erat, Wolfgang
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of forming an electrically conductive contact on an insulated substrate such as a printed circuit board includes the step of defining a contact area, on the substrate and applying a copper buss on the substrate so that it extends beyond, the marginal edges of the contact area. A thin layer of soldermask is then applied to, cover the upper surface of the copper buss outside of the contact area. Thereafter, a Thick Film Polymer (TFP) conductive paste is applied over the copper buss in the, contact area defined on the substrate and over a small portion of the soldermask so, that the copper buss is covered completely.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 7, 1991 and granted June 18, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended November 7, 2011.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 7, 2013.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.